{"product_id":"9784781316130","title":"次世代パワー半導体の開発動向と応用展開","description":"最新パワー半導体を軸に，デバイス設計，プロセス，高耐熱実装技術，評価・標準化などを詳細に紹介。車載機器や5G通信機器応用に加え電動航空機や気象観測レーダへの展開といった新規分野への展望まで詳しく解説。","brand":"シーエムシー出版","offers":[{"title":"Default Title","offer_id":48498406818096,"sku":"","price":73700.0,"currency_code":"JPY","in_stock":true}],"url":"https:\/\/www.maruzenjunkudo.co.jp\/products\/9784781316130","provider":"丸善ジュンク堂書店ネットストア","version":"1.0","type":"link"}