{"product_id":"9784781318509","title":"次世代パワー半導体の熱設計と実装技術《普及版》","description":"SiCやGaNなどWBGパワー半導体の高温・高速・高耐圧動作を支える熱設計技術を解説し、EV向け車載パワーモジュールの高出力密度化に迫る1冊。","brand":"シーエムシー出版","offers":[{"title":"Default Title","offer_id":50373534023984,"sku":null,"price":6270.0,"currency_code":"JPY","in_stock":true}],"url":"https:\/\/www.maruzenjunkudo.co.jp\/products\/9784781318509","provider":"丸善ジュンク堂書店ネットストア","version":"1.0","type":"link"}