{"product_id":"9784781318875","title":"半導体技術資料集","description":"AI需要の急増を背景に半導体の先端プロセスや高度パッケージ技術が進展し 2nmプロセス時代へ突入し始めている。前工程・後工程・応用展開を体系化し，半導体技術を集結した一冊","brand":"シーエムシー出版","offers":[{"title":"Default Title","offer_id":51222375399728,"sku":null,"price":74800.0,"currency_code":"JPY","in_stock":true}],"url":"https:\/\/www.maruzenjunkudo.co.jp\/products\/9784781318875","provider":"丸善ジュンク堂書店ネットストア","version":"1.0","type":"link"}